Look under your car bonnet at the radiator, what shape is it ?
Theres a legitimate reason for rectangle boxes though, all to keep it modular, which has been the successful way for the last 30 years.
From what I have seen on the animation, it is still reasonably modular. Ram still slides in and out etc. And looks like you could pull the center cooling core and then unbolt the components from the frame. It may not like the lego style of component swapping PC users are used too, but it still has the potential to be modular.Heat is one of the big restrictions on what we can get our electronics to do (Cue Bounty Hunter) and if this increases cooling as much as Apple is claiming (or even points further innovation in the right direction) it could lift the restriction a little.Again, Im not a mac fan, but I was under the impression that they weren't really upgradable anyway? So in Apples case, modular construction isn't a concern? May be wrong on that point.
That fan blows the wrong way too, all it's going to do is suck up all the dust off the floor.....
It works by conducting heat away from the CPU and GPUs and distributing that heat uniformly across the core. That way, if one processor isn’t working as hard as the others, the extra thermal capacity can be shared efficiently among them.
from the websiteI wonder how effective this will be.With a normal PC we would have heatsink temps something like this (depending on what it's doing).CPU - 50cGPU1 - 25cGPU2 - 30cWith the Mac Pro, the temps would be averaged out, i.eCPU - 35cGPU1 - 35cGPU2 - 35cIt would be good for the CPU in this case, however the GPUs would get the same heat, even when sitting idle (and vice versa).
Yes and now your CPU's are working 17-40% less efficiently and they have 4-8% less temperature margin.
The cooling system is similar to a watercooling loop with cpu & gfx cards in it.
I wasn't aware that computer chips running at a higher temperature went slower, or required more power to operate. How does this work?
Not quite. A water-cooled system just replaces the air with water as a heat conductor. The heat sinks of each component system are still separate.The water gets pumped to the CPU first and draws away heat, then when it reaches the GPU heatsink, the water is still cooler then the heatsink, and will still draw away the heat. Under no circumstances will the heat from one component ever be transferred to another.
The cooling system is similar to a watercooling loop with cpu & gfx cards in it. If you base the size of your radiators (or heatsink) on the max heat output of all 3 chips (1xcpu and 2xgpus) then you are fine as you have enough surface area to happily keep them cool. But if the size of radiator (or heatsink) is based off only 2/3 of these items being at full load at any one time then you will run into trouble. Presumably you would think apple have allowed enough heatsink surface area to allow all the chips to be cooled at once. I think the placement of the fan at the top is good. Heat rises, so its only natural to have the heat exhausted from the unit at the top. There are clear benefits to having one large fan, in that it can operate at a lower speed than multiple small ones while pushing a similar (or even larger) amount of air, and so is quieter.EDIT:I wasn't aware that computer chips running at a higher temperature went slower, or required more power to operate. How does this work?
Not quite. A water-cooled system just replaces the air with water as a heat conductor. The heat sinks of each component system are still separate.The water gets pumped to the CPU first and draws away heat, then when it reaches the GPU heatsink, the water is still cooler then the heatsink, and will still draw away the heat. Under no circumstances will the heat from one component ever be transferred to another.Electrons have a harder time getting around when it's hot.
You have a single large loop, in this loop there are two gpus, one cpu and a large radiator. The water removes the heat from the chip, and the radiator removes the heat from the water, putting it into the air. The radiator is essentially a heatsink, as it is transferring the heat into the air. The water just removes the heat from the chip faster than air could. I don't see how one large w/c loop is different to one large heatsink. All the chips are still sharing the same cooling system. In one system they share a large heatsink, in the other they share a large radiator.
I don't think you understand my point. Lets say the radiator is large enough to dissipate the heat of one chip at 100% load, but not three. What would happen then? The water going back to the chips would not be able to take the heat away from the chips, the waterblock would eventually heat up and shit would break, right?Which is the same as what would happen if the heatsink in the apple pro was not big enough. If its too small to dissipate the heat, shit will break. But if the heatsink is massively huge, then it will work fine. Same as with a watercooling system, if the radiator is too small, the heat wont leave the system fast enough, and shit will break.
I guess I could nit pick.But fuck, it might look like a big fucking butt plug and it still looks better then anything HP etc etc are doing desktop wise.New Apple Pro.Look at this poorly built pile of steaming shit. Ugly, and bound to break down and fuck your day right up.